Alignment mark, substrate, set of patterning devices, and device manufacturing method
US9025148B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2011 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | May 10, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An alignment mark determines alignment of a first and a second exposure on a substrate on a macro level and a micro level. The alignment mark includes a first alignment pattern projected during the first exposure and a second alignment pattern projected during the second exposure. The alignment mark includes a first sub-mark at least partially defined by the first alignment pattern and a second sub-mark at least partially defined by the second alignment pattern. Relative positions of the first and second sub-marks on the substrate are representative for alignment of the first and second exposures on the macro level. At least one sub-mark is defined by image lines of the first alignment pattern and the second alignment pattern, and wherein relative positions of image lines of the first alignment pattern and image lines of the second alignment pattern of the at least one sub-mark are representative for alignment of the first and second exposures on the micro level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.