Adhesive dam
US9025339B2 · kind B2 · utility
0Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Jun 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.