Advanced handler wafer bonding and debonding

US9029238B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Paul S. Andry · Yorktown Heights, US
• Russell A. Budd · North Salem, US
• John U. Knickerbocker · Wappingers Falls, US
• Robert E. Trzcinski · Rhinebeck, US
• Douglas C. La Tulipe, Jr. · Albany, US

Key dates

• Filing date: Oct 11, 2012
• Grant date: May 12, 2015
• Expiry date: May 9, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for processing a semiconductor wafer includes applying a release layer to a transparent handler. An adhesive layer, that is distinct from the release layer, is applied between a semiconductor wafer and the transparent handler having the release layer applied thereon. The semiconductor wafer is bonded to the transparent handler using the adhesive layer. The semiconductor wafer is processed while it is bonded to the transparent handler. The release layer is ablated by irradiating the release layer through the transparent handler with a laser. The semiconductor wafer is removed from the transparent handler.