Inventor · Rhinebeck, NY, US

Robert E. Trzcinski

19Patents
6h-index
20Co-inventors
62Inventor score

Filing activity: May 18, 2006 → Mar 25, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US9029238B2 Advanced handler wafer bonding and debonding Electricity 23 Active
US7518850B2 High yield, high density on-chip capacitor design Electricity 10 Active
US7939910B2 Structure for symmetrical capacitor Electricity 9 Active
US7859825B2 High yield, high density on-chip capacitor design Electricity 8 Active
US8419895B2 Laser ablation for integrated circuit fabrication Emerging Cross-Sectional Technologies 7 Active
US7816197B2 On-chip adjustment of MIMCAP and VNCAP capacitors Electricity 6 Active
US8679280B2 Laser ablation of adhesive for integrated circuit fabrication Emerging Cross-Sectional Technologies 5 Active
US7838384B2 Structure for symmetrical capacitor Electricity 4 Active
US7579644B2 Adjustable on-chip sub-capacitor design Electricity 3 Active
US10168478B2 Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Electricity 3 Active
US7504705B2 Striped on-chip inductor Electricity 2 Active
US9632251B2 Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Electricity 2 Active
US8227891B2 Striped on-chip inductor Electricity 1 Active
US9606142B2 Test probe substrate Electricity 0 Active
US9851379B2 Test probe substrate Electricity 0 Active
US8388782B2 Handler attachment for integrated circuit fabrication Emerging Cross-Sectional Technologies 0 Active
US10168477B2 Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Electricity 0 Active
US8937355B2 Striped on-chip inductor Electricity 0 Active
US9897627B2 Test probe substrate Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.