Controlling temperature of a faraday shield
US9029267B2 · kind B2 · utility
2Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | May 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3065
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for controlling thermal cycling of a faraday shield in a plasma process chamber is provided. The method includes: performing a first plasma processing operation on a first wafer in the plasma process chamber; terminating the first plasma processing operation; performing a first wafer transfer operation to transfer the first wafer out of the chamber; and, during the first wafer transfer operation, applying power to a TCP coil under a plasma limiting condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.