Method of manufacturing grooved chemical mechanical polishing layers
US9034063B2 · kind B2 · utility
0Cited by
6References
1Claims
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Key dates
| Filing date | Sep 27, 2012 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Jul 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing grooved polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of defects in the polishing layers are minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.