Apparatus and methods for quad flat no lead packaging
US9034697B2 · kind B2 · utility
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11References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 14, 2011 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Mar 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined number of lead elements are placed on the lead frame, and connecting other components on the lead frame to the lead elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.