Cooling pedestal for dicing tape thermal management during plasma dicing
US9034771B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 23, 2014 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | May 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma etch chamber includes a plasma source disposed in an upper region of the plasma etch chamber. The plasma etch chamber also includes a cathode assembly disposed below the plasma source. The cathode assembly includes a cooling RF-powered chuck for supporting an inner portion of a backside of a substrate carrier. The cathode assembly also includes a cooling RF-isolated support surrounding but isolated from the RF-powered chuck. The RF-isolated support is for supporting an outer portion of the backside of the substrate carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.