Ultrasonic cleaning fluid, method and apparatus
US9044794B2 · kind B2 · utility
6Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2009 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Dec 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cleaning fluid including dispersed gas avoids using ultrasonic energy to induce cavitation by subjecting a liquid containing dissolved gas to a pressure reduction in a bubble machine, to generate a gas/liquid dispersion. The cleaning fluid can be used to clean articles such as semiconductor wafers using a device that includes a holder and a vibrator for supplying ultrasonic or megasonic energy to the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.