Processes and solutions for substrate cleaning and electroless deposition
US9048088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2009 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Jan 27, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention pertains to fabrication of devices. One embodiment is a method of substrate cleaning and electroless deposition of a cap layer for an integrated circuit. The method is performed on a substrate having a surface comprising a metal and dielectric damascene metallization layer. The method comprises exposing the surface of the substrate to a cleaning solution sufficient to clean the surface of the substrate and exposing the surface of the substrate to an electroless deposition solution sufficient to deposit the cap layer. Other embodiments of the present invention include solutions to clean the substrate and solutions to accomplish electroless deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.