Method of fabricating interconnect structure for package-on-package devices
US9048222B2 · kind B2 · utility
971Cited by
8References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 6, 2013 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Jul 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.