Substrate liquid treatment apparatus with lift pin plate
US9048269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2011 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Apr 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a liquid treatment apparatus for processing a lower surface of the substrate. The apparatus includes a first nozzle disposed below a lower surface of the substrate retained by the substrate retaining unit to eject a treatment liquid towards the lower surface of the substrate, the first nozzle having a plurality of first ejection ports, which are arrayed from a position opposing a central portion of the substrate retained by the substrate retaining unit to a position opposing a peripheral portion of the substrate retained by the substrate retaining unit. An ejecting direction of the treatment liquid ejected from the first ejection port is inclined towards a rotation direction of the substrate rotated by the rotational driving unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.