Patent · US Active

Device including two power semiconductor chips and manufacturing thereof

US9048338B2 · kind B2 · utility

10Cited by

11References

5Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Khalil Hosseini · Weihmichl, DE
Manfred Mengel · Bad Abbach, DE
Joachim Mahler · Regensburg, DE
Franz-Peter Kalz · Regensburg, DE

Key dates

Filing date	Nov 4, 2011
Grant date	Jun 2, 2015
Priority date	—
Expiry date	Sep 27, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.