Projection exposure apparatus with optimized adjustment possibility

US9052609B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Boris Bittner · Roth, DE
• Holger Walter · Aalen, DE
• Matthias Roesch · Aalen, DE

Key dates

• Filing date: Mar 3, 2014
• Grant date: Jun 9, 2015
• Expiry date: Mar 3, 2034

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70891
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A projection exposure apparatus for microlithography includes: an illumination system configured to illuminate a mask in an object field with exposure light; and a projection objective comprising multiple optical elements configured to image the exposure light from the mask in the object field to a wafer in an image field. The projection exposure apparatus is a wafer scanner configured to move the wafer relative to the mask during an exposure of the wafer with the exposure light. The projection objective further includes at least one manipulator configured to manipulate at least one of the optical elements and a control unit configured to control the manipulator. The control unit is configured to manipulate the optical element with the manipulator during the exposure of the wafer with the exposure light.