Integrated circuit packaging system with underfill and method of manufacture thereof
US9053953B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Jul 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system, and a method of manufacture thereof, including: a device formed as a die having a conductor with ends exposed on opposite sides of the die; a first surface depression on the device, the first surface depression surrounding one of the ends of the conductor exposed at a stack side of the die; a first component over and connected to the conductor, the first component surrounded by the first surface depression; and a first underfill between and in direct contact with the first component and the device, the first underfill substantially filled to a side of an inner edge and within a perimeter of the first surface depression isolated from the conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.