DaeWook Yang
8Patents
2h-index
9Co-inventors
36Inventor score
Filing activity: Aug 14, 2008 → Mar 15, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8421201B2 | Integrated circuit packaging system with underfill and methods of manufacture thereof | Electricity | 9 | Active |
| US8409918B2 | Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting | Electricity | 4 | Active |
| US9053953B1 | Integrated circuit packaging system with underfill and method of manufacture thereof | Electricity | 1 | Active |
| US8836097B2 | Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding | Electricity | 1 | Active |
| US8936969B2 | Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape | Electricity | 0 | Active |
| US8709877B2 | Integrated circuit packaging system with an encapsulation and method of manufacture thereof | Electricity | 0 | Active |
| US8841782B2 | Integrated circuit package system with mold gate | Electricity | 0 | Active |
| US8716108B2 | Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.