Stacked interconnect heat sink
US9054064B2 · kind B2 · utility
0Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2013 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Jun 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.