Method for forming a circuit board via structure for high speed signaling
US9055702B2 · kind B2 · utility
0Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2013 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Aug 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.