Method for forming die assembly with heat spreader
US9059144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2012 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a molded die assembly includes attaching a first major surface of a semiconductor die onto a package substrate; attaching a heat spreader to a second major surface of the semiconductor die, wherein the second major surface is opposite the first major surface, and wherein the semiconductor die, package substrate, and heat spreader form a die assembly; conforming a die release film to a transfer mold; closing the transfer mold around the die assembly such that the die release film is compressed against the heat spreader and a cavity is formed around the die assembly; transferring a thermoset material into the cavity; and releasing the die assembly from the die release film and the transfer mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.