Patent · US Active

Methods for processing a semiconductor wafer

US9059273B2 · kind B2 · utility

0Cited by

0References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Petra Fischer · Wernberg, AT
Michael Roesner · Villach, AT
Gudrun Stranzl · Eisenlohrsweg, AT

Key dates

Filing date	Aug 30, 2013
Grant date	Jun 16, 2015
Priority date	—
Expiry date	Aug 30, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/03001
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for processing a semiconductor wafer in accordance with various embodiments may include: providing a semiconductor wafer including at least one chip and at least one kerf region adjacent to the at least one chip, the kerf region including at least one auxiliary structure; applying a mask layer to the semiconductor wafer; removing the at least one auxiliary structure in the at least one kerf region; removing the applied mask layer; and separating the semiconductor wafer along the at least one kerf region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.