Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
US9060431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2012 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Mar 12, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12049
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a copper-clad laminate obtainable by bonding a copper foil on which roughening treatment including copper-cobalt-nickel alloy plating is performed and a liquid crystal polymer to each other, wherein the copper-clad laminate is free from a roughening particle residue on a surface of the liquid crystal polymer resin after copper foil circuit etching. The copper-clad laminate obtainable by bonding a copper foil and a liquid crystal polymer to each other, wherein the copper foil includes a copper primary particle layer formed on a surface bonded to the liquid crystal polymer and a secondary particle layer formed on the primary particle layer and made from a ternary alloy including copper, cobalt, and nickel; the primary particle layer has an average particle size of 0.25 to 0.45 μm; and the secondary particle layer has an average particle size of 0.05 to 0.25 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.