Patent · US Active

Photolithography mask method for a wafer, method for producing same, and photolithography method for wafer using the same

US9063407B2 · kind B2 · utility

0Cited by

0References

15Claims

0Family size

Assignee

DISCO CORPORATION · JP

Inventors

Florian Bieck · Singapore, SG
Sven-Manfred Spiller · Hannover, DE

Key dates

Filing date	Aug 10, 2011
Grant date	Jun 23, 2015
Priority date	—
Expiry date	Jun 8, 2032

Classification

Technology area (CPC G)Physics
CPC primaryG03F1/62
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A photolithography mask for a semiconductor wafer. The mask includes a protrusion section that protrudes from a handling section of the mask. An outer shape of the handling section enables handling by a mask aligner device. The protrusion includes a face surface provided at a level which is different from a face surface area of the handling section.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.