Transferring heat through an optical layer of integrated circuitry

US9064080B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Harry Barowski · Balingen, DE
• Thomas J. Brunschwiler · Thalwil, CH
• Roger F. Dangel · Zug, CH
• Hubert Harrer · Böblingen, DE
• Andreas Huber · Holzgerlingen, DE
• Norbert M. Meier · Thalwil, CH
• Bruno Michel · Thalwil, CH
• Tim Niggemeier · Laatzen, DE
• Stephan Paredes · Thalwil, CH
• Jochen Supper · Herrenberg, DE
• Jonas R. Weiss · Thalwil, CH

Key dates

• Filing date: Jan 20, 2011
• Grant date: Jun 23, 2015
• Expiry date: Jan 25, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.