Patent · US Active

Heat spreader for integrated circuit device

US9064838B2 · kind B2 · utility

3Cited by

9References

14Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Ruzaini B. Ibrahim · Kapar, MY
Mohd Rusli Ibrahim · Shah Alam, MY
Nor Azam Man · Ampang Jaya, MY

Key dates

Filing date	Sep 17, 2013
Grant date	Jun 23, 2015
Priority date	—
Expiry date	Sep 17, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A BGA type packaged integrated circuit (IC) die has an exposed coronal heat spreader. The die, which is attached to a substrate, is encapsulated in a central segment of molding compound. The central segment is laterally surrounded by, and separated by a moat from a ring segment of molding compound, to a form a slot. The coronal heat spreader is inserted into the slot to cap the central segment. The coronal heat spreader is attached to the substrate and to the central segment with thermal glue. In operation, at least some of the heat generated by the die is dissipated through the coronal heat spreader.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.