Patent · US Active

Chip with encapsulated sides and exposed surface

US9064883B2 · kind B2 · utility

123Cited by

0References

7Claims

0Family size

Assignee

Intel Mobile Communications GmbH · DE

Inventors

Thorsten Meyer · Regensburg, DE
Klaus Reingruber · Langquaid, DE
David O'Sullivan · Ottobrunn, DE

Key dates

Filing date	Aug 25, 2011
Grant date	Jun 23, 2015
Priority date	—
Expiry date	Nov 30, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/2064
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.