Substrate liquid processing apparatus, liquid processing method, and storage medium
US9064908B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 7, 2012 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a liquid processing apparatus capable of efficiently processing a pattern formation surface of a wafer, while preventing diffusion of a chemical-liquid atmosphere which might possibly occurs during a chemical-liquid process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.