Monitoring retaining ring thickness and pressure control
US9067295B2 · kind B2 · utility
8Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus includes a carrier head including a retaining ring having a plastic portion with a bottom surface to contact a polishing pad, an in-situ monitoring system including a sensor that generates a signal that depends on a thickness of the plastic portion, and a controller configured to receive the signal from the in-situ monitoring system and to adjust at least one polishing parameter in response to the signal to compensate for non-uniformity caused by changes in the thickness of the plastic portion of the retaining ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.