Polishing pad with grooved foundation layer and polishing surface layer
US9067298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2011 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Jul 27, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.