Method and device for permanent bonding of wafers, as well as cutting tool
US9067363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2012 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Jul 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material. The method including the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 μm; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.