Patent · US Active

Buried digitline (BDL) access device and memory array

US9070584B2 · kind B2 · utility

2Cited by
3References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 24, 2013
Grant dateJun 30, 2015
Priority date
Expiry dateMay 24, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10B12/488
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A memory array includes a plurality of digitline (DL) trenches extending along a first direction; a buried digitline between the DL trenches; a trench fill material layer sealing an air gap in each of the DL trenches; a plurality of wordline (WL) trenches extending along a second direction; an active chop (AC) trench disposed at one end of the buried digitline; a shield layer in the air gap; and a sidewall conductor around the sidewall of the AC trench.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.