Buried digitline (BDL) access device and memory array
US9070584B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | May 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/488
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory array includes a plurality of digitline (DL) trenches extending along a first direction; a buried digitline between the DL trenches; a trench fill material layer sealing an air gap in each of the DL trenches; a plurality of wordline (WL) trenches extending along a second direction; an active chop (AC) trench disposed at one end of the buried digitline; a shield layer in the air gap; and a sidewall conductor around the sidewall of the AC trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.