Heat conductive substrate for integrated circuit package
US9070657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2013 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Oct 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a substrate having a heat conducting portion integrally formed with a heat dissipating portion. First and second integrated circuit dies are mounted to opposite sides of the heat conducting portion of the substrate. The first and second integrated circuit dies may each be packaged as flip-chip configurations. Electrical connections between contact pads on the first and second integrated circuit dies may be formed through openings formed in the heat conducting portion of the substrate. The heat dissipating portion may be positioned externally from a location between the first and second integrated circuit dies so that it dissipates heat away from the integrated circuit package into the surrounding environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.