Sequential stage mixing for a resist batch strip process
US9075318B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2012 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Oct 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method and system for stripping a resist film on a plurality of substrates in a resist removal system comprising a processing chamber coupled to a recirculation system comprising a recycle sub-system and a bypass sub-system. The recycle sub-system includes a recycle line, an inline heater, a ratio monitor and control system, and recirculation injection device. The bypass sub-system comprises a treatment liquid supply line, a first injection line, a mixing device, and a second injection line. The treatment liquid comprises a primary stripping chemical, secondary stripping chemical, tertiary stripping chemical, and one or more reactive products. One or more of the temperatures, concentrations, and/or flow rates of the recirculated treatment liquid and/or injected stripping chemicals are adjusted to meet a target strip rate and selectivity for strip over etch of silicon nitride or silicon oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.