Patent · US Active

Plasma processing apparatus, plasma processing method and storage medium for storing program for executing the method

US9076636B2 · kind B2 · utility

25Cited by
1References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 14, 2011
Grant dateJul 7, 2015
Priority date
Expiry dateJan 10, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/68735
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

There is provided a plasma processing apparatus including a susceptor 114, having a substrate mounting portion for mounting thereon a substrate, to which a high frequency power is applied; a focus ring 210, disposed to surround the substrate mounted on the substrate mounting portion, including an outer ring 214 having a top surface higher than a top surface of the substrate and an inner ring 212 extending inwardly from the outer ring so as to allow at least a part of the inner ring to be positioned below a periphery of the substrate, the outer ring and the inner ring being formed as a single member; a dielectric ring 220 positioned between the focus ring and the susceptor; a dielectric constant varying device 250 for varying a dielectric constant of the dielectric ring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.