Dual-sided film-assist molding process
US9076802B1 · kind B1 · utility
4Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2013 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Jan 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Simultaneous semiconductor packages can be produced using a dual-sided film-assist molding process. The process involves using a film or membrane having opposing surfaces for receiving un-encapsulated semiconductor packages on both surfaces. A slot can be formed in the film or membrane to facilitate introduction and passage of the encapsulation therethrough such that upon removal of the film or membrane, increased throughput and productivity of the completed semiconductor packages can be carried out to achieve considerable cost savings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.