Method for monitoring alignment between contact holes and polycrystalline silicon gate
US9080863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Apr 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to the semiconductor manufacturing field, especially a method for monitoring alignment between contact holes and polycrystalline silicon gate by setting a plurality of equidistant contact holes with same sharp on poly-silicon and residual active area, and then obtain the process alignment profile of the quantized values in the plane in order to have a better control of process quality, thereby have a better control of the quality of the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.