Rigid probe with compliant characteristics
US9081034B2 · kind B2 · utility
0Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2013 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Aug 4, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of probing compliant bumps of a circuit with probes is described. The method includes disposing the probes on a substrate, a base of each of the probes being coupled to the substrate. The method also includes disposing the circuit such that each of the compliant bumps is in contact with the probe tip of a corresponding one of the probes, each probe tip being connected to each base of each probe through a cantilever, and supplying current to the probes to test the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.