3DIC packages with heat dissipation structures
US9082743B2 · kind B2 · utility
14Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2013 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Aug 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion not overlapped by the first die. A first Thermal Interface Material (TIM) is over and contacting a top surface of the first die. A heat dissipating lid has a first bottom surface contacting the first TIM. A second TIM is over and contacting the second portion of the second die. A heat dissipating ring is over and contacting the second TIM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.