Substrate processing apparatus and method of manufacturing semiconductor device
US9082797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Apr 21, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2009/0056
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A substrate processing apparatus capable of increasing the life span of a lamp for heating a substrate is provided. The substrate processing apparatus includes: a light receiving chamber for processing a substrate; a substrate support unit inside the light receiving chamber; a lamp including an electrical wire, and a seal accommodating the electrical wire to hermetically seal the lamp with a gas therein, the lamp irradiating the substrate with a light; a lamp receiving unit outside the light receiving chamber to accommodate the lamp therein, the lamp receiving unit including a lamp connector connected to the lamp to supply an electric current through the electrical wire, a heat absorption member including a material having a thermal conductivity higher than that of the seal, and a base member fixing the heat absorption member; and an external electrical wire connected to the lamp connector to supply current to the lamp connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.