Patent · US Active

Component having a via

US9082831B2 · kind B2 · utility

0Cited by

2References

6Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Marcus Ahles · Pfullingen, DE
Jochen Reinmuth · Reutlingen, DE
Hubert Benzel · Neckartenzlingen, DE
Simon Armbruster · Wannweil, DE

Key dates

Filing date	Sep 7, 2011
Grant date	Jul 14, 2015
Priority date	—
Expiry date	Apr 9, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.