High performance e-fuse fabricated with sub-lithographic dimension
US9093453B2 · kind B2 · utility
6Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2013 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic fuse link with lower programming current for high performance and self-aligned methods of forming the same. The invention provides a horizontal e-fuse structure in the middle of the line. A reduced fuse link width is achieved by spacers on sides of pair of dummy or active gates, to create sub-lithographic dimension between gates with spacers to confine a fuse link. A reduced height in the third dimension on the fuse link achieved by etching the link, thereby creating a fuse link having a sub-lithographic size in all dimensions. The fuse link is formed over an isolation region to enhanced heating and aid fuse blow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.