Multi-die MEMS package
US9095072B2 · kind B2 · utility
19Cited by
70References
9Claims
0Family size
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Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Apr 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.