Cenk Acar
40Patents
19h-index
19Co-inventors
78Inventor score
Filing activity: May 2, 2002 → Aug 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7240552B2 | Torsional rate sensor with momentum balance and mode decoupling | Physics | 83 | Expired |
| US8113050B2 | Robust six degree-of-freedom micromachined gyroscope with anti-phase drive scheme and method of operation of the same | Emerging Cross-Sectional Technologies | 69 | Active |
| US6845669B2 | Non-resonant four degrees-of-freedom micromachined gyroscope | Emerging Cross-Sectional Technologies | 66 | Expired |
| US7461552B2 | Dual axis rate sensor | Physics | 61 | Active |
| US7284430B2 | Robust micromachined gyroscopes with two degrees of freedom sense-mode oscillator | Physics | 46 | Expired |
| US7100446B1 | Distributed-mass micromachined gyroscopes operated with drive-mode bandwidth enhancement | Physics | 39 | Expired |
| US8739626B2 | Micromachined inertial sensor devices | Electricity | 38 | Active |
| US7222533B2 | Torsional rate sensor with momentum balance and mode decoupling | Physics | 33 | Expired |
| US7377167B2 | Nonresonant micromachined gyroscopes with structural mode-decoupling | Physics | 33 | Expired |
| US8978475B2 | MEMS proof mass with split z-axis portions | Physics | 31 | Active |
| US8813564B2 | MEMS multi-axis gyroscope with central suspension and gimbal structure | Performing Operations; Transporting | 30 | Active |
| US8516886B2 | Micromachined piezoelectric X-Axis gyroscope | Emerging Cross-Sectional Technologies | 26 | Active |
| US8710599B2 | Micromachined devices and fabricating the same | Electricity | 26 | Active |
| US7421898B2 | Torsional nonresonant z-axis micromachined gyroscope with non-resonant actuation to measure the angular rotation of an object | Physics | 23 | Expired |
| US9455354B2 | Micromachined 3-axis accelerometer with a single proof-mass | Physics | 21 | Active |
| US9062972B2 | MEMS multi-axis accelerometer electrode structure | Physics | 20 | Active |
| US9156673B2 | Packaging to reduce stress on microelectromechanical systems | Electricity | 20 | Active |
| US9278846B2 | Micromachined monolithic 6-axis inertial sensor | Physics | 20 | Active |
| US9095072B2 | Multi-die MEMS package | Electricity | 19 | Active |
| US9006846B2 | Through silicon via with reduced shunt capacitance | Performing Operations; Transporting | 18 | Active |
| US8584522B2 | Micromachined piezoelectric x-axis gyroscope | Emerging Cross-Sectional Technologies | 16 | Active |
| US9278845B2 | MEMS multi-axis gyroscope Z-axis electrode structure | Performing Operations; Transporting | 15 | Active |
| US9246018B2 | Micromachined monolithic 3-axis gyroscope with single drive | Physics | 14 | Active |
| US7279761B2 | Post-release capacitance enhancement in micromachined devices and a method of performing the same | Performing Operations; Transporting | 13 | Expired |
| US8516887B2 | Micromachined piezoelectric z-axis gyroscope | Emerging Cross-Sectional Technologies | 12 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.