Deposition valve assembly and method of heating the same
US9096931B2 · kind B2 · utility
515Cited by
177References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2011 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Jul 1, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/7036
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A valve assembly including a mounting block having a first surface, a plurality of valves connected to the mounting block first surface, at least one fluid line connecting the plurality of valves spaced apart from the mounting block first surface, a heating element spaced apart from the at least one fluid line and located within a first insulating layer, and wherein the first insulating layer extends less than completely around the at least one fluid line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.