Apparatus and method for three dimensional inspection of wafer saw marks

US9103665B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Benoit Maison · White Plains, US
• Andy Hill · Sunnyvale, US
• Laurent Hermans · Borsbeek, BE
• Frans Nijs · Leopoldsburg, BE
• Karel Van Gils · Blanden, BE
• Christophe Wouters · Balen, BE

Key dates

• Filing date: Apr 12, 2011
• Grant date: Aug 11, 2015
• Expiry date: Oct 5, 2032

Classification

• Technology area (CPC —): General

Abstract

An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (α) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).