Optical electronic package
US9105766B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Oct 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/94112
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.