Patent · US Active

Method for manufacturing an integrated circuit and an integrated circuit

US9107335B2 · kind B2 · utility

2Cited by

0References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Marko Lemke · Dresden, DE
Mirko Vogt · Dresden, DE
Stefan Tegen · Dresden, DE

Key dates

Filing date	Feb 19, 2013
Grant date	Aug 11, 2015
Priority date	—
Expiry date	Nov 14, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49108
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for manufacturing an integrated circuit may include forming an electronic circuit in or above a carrier; forming at least one metallization layer structure configured to electrically connect the electronic circuit; and forming a solid state electrolyte battery at least partially in the at least one metallization layer structure, wherein the solid state electrolyte battery is electrically connected to the electronic circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.