Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
US9108841B1 · kind B1 · utility
14Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Mar 5, 2014 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Mar 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.