Integrated circuits with protected resistors and methods for fabricating the same
US9111756B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
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Key dates
| Filing date | Sep 23, 2013 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Jan 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/47
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus are provided for an integrated circuit with a transistor and a resistor. The method includes depositing a first dielectric layer over the transistor and the resistor, followed by an amorphous silicon layer. The amorphous silicon layer is implanted over the resistor to produce an etch mask, and the amorphous silicon layer and first dielectric layer are removed over the transistor. A contact location on the transistor is then silicided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.