Fan out package, semiconductor device and manufacturing method thereof
US9111914B2 · kind B2 · utility
37Cited by
0References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 22, 2014 |
| Grant date | Aug 18, 2015 |
| Priority date | — |
| Expiry date | Dec 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fan out package includes a molding compound, a conductive plug in the molding compound, a dielectric covering the molding compound and a portion of the conductive plug, and an interconnect disposed over the dielectric and contacted with the conductive plug, wherein a width of the interconnect contacting the conductive plug is substantially smaller than a width of the conductive plug in the molding compound, and a width of the interconnect disposed over the dielectric is substantially greater than the width of the conductive plug in the molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.