Alignment to multiple layers
US9117775B2 · kind B2 · utility
1Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2012 |
| Grant date | Aug 25, 2015 |
| Priority date | — |
| Expiry date | May 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of aligning a new pattern to more than one previously defined pattern during the manufacture of an integrated circuit. A method of aligning a photolighography pattern reticle to a first previously defined pattern in a first direction and also aligning the photolithography pattern reticle to a second previously defined pattern in a second direction. A method of aligning a photolighography pattern reticle to two previously defined patterns in the same direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.